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industrial and multi-market data sheet revision 1.0, 2011-05-19 final esd0p2rf series bi-directional ultra-low capacitanc e esd / transient protection diode esd0p2rf-02ls esd0p2rf-02lrh tvs diodes transient voltage suppressor diodes
edition 2011-05-19 published by infineon technologies ag 81726 munich, germany ? 2011 infineon technologies ag all rights reserved. legal disclaimer the information given in this docu ment shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infine on technologies hereby disclaims any and all warranties and liabilities of any kind, including witho ut limitation, warranties of non-infrin gement of intellectua l property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies compon ents may be used in life-su pport devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safe ty or effectiveness of that de vice or system. life support devices or systems are intended to be implanted in the hu man body or to support an d/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
esd0p2rf series final data sheet 3 revision 1.0, 2011-05-19 trademarks of infineon technologies ag aurix?, bluemoon?, c166?, ca npak?, cipos?, cipurse?, comn eon?, econopack?, coolmos?, coolset?, corecontrol?, crossave?, dave?, easypim?, econobri dge?, econodual?, econopim?, eicedriver?, eupec?, fcos?, hitfe t?, hybridpack?, i2rf?, isoface?, isopack?, mipaq?, modstack?, my-d?, novalithic?, omnitune?, optimos?, origa?, primarion?, primepack?, primestack?, pro- sil?, profet?, rasic?, reve rsave?, satric?, sieget?, sindrion?, sipmos?, smarti?, smartlewis ?, solid flash?, tempfet?, thinq!?, trenchstop?, tricore?, x-go ld?, x-pmu?, xmm?, xposys?. other trademarks advance design system? (ads) of agilent te chnologies, amba?, arm?, multi-ice?, keil?, primecell?, realview?, thumb?, vision? of arm limited, uk. autosar? is licensed by autosar development partnership. bluetooth? of bluetooth sig inc. cat-iq? of dect forum. colossus?, firstgps? of trimble navigation ltd. emv? of emvc o, llc (visa holdings in c.). epcos? of epcos ag. flexgo? of microsoft corp oration. flexray? is licensed by fl exray consortium. hyperterminal? of hilgraeve incorporated. iec? of commission electrotec hnique internationale. ir da? of infrared data association corporation. iso? of international organization for standardization. matlab? of mathworks, inc. maxim? of maxim integrated products, inc. microtec?, nucleus? of mentor graphics corporation. mifare? of nx p. mipi? of mipi alliance, inc. mips? of mips technologies, inc., usa. murata? of murata manufacturing co., microwave offi ce? (mwo) of applied wave research inc., omnivision? of omnivision technologies, inc. openwa ve? openwave systems inc. red hat? red hat, inc. rfmd? rf micro devices, inc. sirius? of sirius sate llite radio inc. solaris? of sun microsystems, inc. spansion? of spansion llc ltd. symbian? of symb ian software limited. taiyo yuden? of taiyo yuden co. teaklite? of ceva, inc. t ektronix? of tektroni x inc. toko? of toko kabushiki kaisha ta. unix? of x/open company limited. verilog?, palladium? of cadence design systems, inc. vlynq? of texas instruments inco rporated. vxworks?, wind river? of wind river systems, inc. zetex? of diodes zetex limited. last trademarks update 2010-10-26 revision history page or item subjects (major changes since previous revision) revision 1.0, 2011-05-19
esd0p2rf series table of contents final data sheet 4 revision 1.0, 2011-05-19 table of contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 list of figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 list of tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 predefined names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1 bi-directional ultra-lo w capacitance esd / transient protection diode . . . . . . . . . . . . . . . . . . . . 8 1.1 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.2 application examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2 product description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.1 electrical char acteristics at t a =25c, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.2 typical characteristics at t a = 25 c, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 4 application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5 ordering information scheme (examples) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 6 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 6.1 pg-tslp-2-17 (mm) [5] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 7 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 7.1 pg-tsslp-2-1 (mm) [5] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 references . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 table of contents
esd0p2rf series list of figures final data sheet 5 revision 1.0, 2011-05-19 figure 2-1 pin configuration and schematic diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 figure 3-1 definitions of electrical char acteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 figure 3-2 reverse current: i r = f ( v r ), t a = parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 figure 3-3 line capacitance: c l = f ( v r ), f = 1 mhz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 figure 3-4 line capacitance: c l = f ( f ), v r = parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 3-5 line capacitance: c l = f ( t a ), v r = parameter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 figure 3-6 iec61000-4-2 v cl = f ( t ), 8 kv positiv pulse from pin 1 to pin 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 3-7 iec61000-4-2 v cl = f ( t ), 8 kv negativ pulse from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 figure 3-8 iec61000-4-2 v cl = f ( t ), 15 kv positiv pulse from pin 1 to pin 2. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 3-9 iec61000-4-2 v cl = f ( t ), 15 kv negativ pulse from pin 1 to pin 2 . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 3-10 clamping voltage : i tlp = f ( v tlp ) [4] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 figure 4-1 single line, bi-directi onal esd / transient protection [1] , [2] , [3] . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 5-1 ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 6-1 pg-tslp-2-17: package overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 6-2 pg-tslp-2-17: footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 6-3 pg-tslp-2-17: packing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 6-4 pg-tslp-2-17: marking (example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 figure 7-1 pg-tsslp-2-1: package overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 figure 7-2 pg-tsslp-2-1: footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 figure 7-3 pg-tsslp-2-1: packing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 figure 7-4 pg-tsslp-2-1: marking (example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 list of figures
esd0p2rf series list of tables final data sheet 6 revision 1.0, 2011-05-19 table 2-1 ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 3-1 maximum ratings at t a = 25 c, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 3-2 dc characteristics at t a = 25 c, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 3-3 rf characteristics at t a = 25 c, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 table 3-4 esd characteristics at t a = 25 c, unless otherwise specified . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 list of tables
esd0p2rf series predefined names final data sheet 7 revision 1.0, 2011-05-19 predefined names ----------------------------------------------------------------------------- definition of ?predefined names? frequently used expressions, such as component names, file names, tools re leases, version numbers, proprietary variables and software links, can be used in a similar way as user variables. however, they must be listed in a special table and not in the standard file ?variables?. correct usage steps: 1. insert all expressions into the left column of the above table. 2. insert an initial cross-re ference into the right column of the same row. the initial cross-reference is necessary to ensure that a single id is used in all your documents using the ?predefined_names.fm? file (example: x-gold has the unique id = chdghjgh). 3. insert a cross-reference (element ?crossreference?) in to your document to the element identifier of the ?predefined_names.fm? file. set the output format of the cross-reference to ?variable? (example: x-gold). notes 1. all documents in a project (such as xmm) and within a book should use the same file ?predefined names?. this allows copying content betwee n different documents. for this reas on, local versions of ?predefined names? must not be produced. 2. new definitions must be inserted in a new row. never change existing definitions, as they might be used in other documents. 3. this file does not need to be included in your book, but it must be in the fm su b-folder of your document. 4. you can sort the above table with framemaker only if the initial cross-reference in the right column has been properly inserted. otherwise, the table may only be sort ed by hand, as the cross-references to your document would get lost. name initial cross-reference x-gold x-gold xmm xmm
esd0p2rf series bi-directional ultra-low capacitan ce esd / transient protection diode final data sheet 8 revision 1.0, 2011-05-19 1 bi-directional ultra-low capaci tance esd / transient protection diode 1.1 features ? esd / transient protection of rf signal lines according to: ? iec61000-4-2 (esd): 20 kv (contact) ? iec61000-4-4 (eft): 40 a (5/50 ns) ? iec61000-4-5 (surge): 3 a (8/20 s) ? maximum working voltage: v rwm 5.3 v ? extremely low capacitance: c l = 0.2 pf (typical) ? low clamping voltage: v cl = 29 v at i pp = 16 a (typical) ? very low reverse current i r < 1 na typ. ? very small form factor down to 0.62 x 0.32 x 0.31 mm 3 ? pb-free (rohs compliant) and halogen free package 1.2 application examples ? esd protection of sensitive rf signal lines , bluetooth class 2, automated meter reading ? rf antenna protection, frontend module, gps, mobile tv, fm radio, uwb 2 product description figure 2-1 pin configurati on and schematic diagram table 2-1 ordering information type package configuration marking code esd0p2rf-02ls pg-tslp-2-1 1 line, bi-directional t esd0p2rf-02lrh pg-tsslp-2-17 1 line, bi-directional t a) pin configuration pg-ts(s)lp-2_dual_diode_serie_pinconf_and_schematicdiag.vsd b) schematic diagram tslp-2 tsslp-2 pin 1 pin 2 pin 1 pin 2 pin 1 pin 2 pin 1 marking (lasered)
esd0p2rf series characteristics final data sheet 9 revision 1.0, 2011-05-19 3 characteristics 3.1 electrical characteristics at t a =25c, unless otherwise specified figure 3-1 definitions of electrical characteristics table 3-1 maximum ratings at t a = 25 c, unless otherwise specified parameter symbol values unit min. typ. max. esd contact discharge 1) 1) v esd according to iec61000-4-2 v esd ??20kv peak pulse current ( t p = 8/20 s) 2) 2) i pp according to iec61000-4-5 i pp ??3a operating temperature range t op -55 ? 125 c storage temperature t stg -65 ? 150 c table 3-2 dc characteristics at t a = 25 c, unless otherwise specified parameter symbol values unit note / test condition min. typ. max. reverse working voltage v rwm ?5.3 ? 5.3 v breakdown voltage v br 7??v i r = 1 ma, from pin 1 to pin 2, from pin 2 to pin 1 reverse current i r ?<150na v r = 5.3 v diode_characteristic_curve_bi-directional .vsd i i rwm v rwm v cl i pp i br v br i rwm v rwm v cl i pp i br v br v r dyn r dyn dynamic resistance r dyn v br breakdown voltage v rwm reverse working voltage maximum v cl clamping voltage i pp peak pulse current
esd0p2rf series characteristics final data sheet 10 revision 1.0, 2011-05-19 table 3-3 rf characteristics at t a = 25 c, unless otherwise specified parameter symbol values unit note / test condition min. typ. max. diode capacitance c l ? 0.23 0.4 pf v r = 0 v, f = 1 mhz ?0.20.4pf v r = 0 v, f = 1 ghz table 3-4 esd characteristics at t a = 25 c, unless otherwise specified parameter symbol values unit note / test condition min. typ. max. clamping voltage 1) v cl ?29?v i pp = 16 a ?38?v i pp = 30 a dynamic resistance 1) 1)please refer to application note an210 [4] . tlp parameter: z 0 = 50 , t p = 100ns, t r = 300ps, averaging window: t 1 = 30 ns to t 2 = 60 ns, extraction of dynamic resistance us ing least squares fit of tlp charactertistics between i pp1 = 10 a and i pp2 = 40 a. r dyn ?1? ? series inductance l s ? 0.2 ? nh esd0p2rf-02ls ? 0.4 ? nh esd0p2rf-02lrh
esd0p2rf series characteristics final data sheet 11 revision 1.0, 2011-05-19 3.2 typical characteristics at t a = 25 c, unless otherwise specified figure 3-2 reverse current: i r = f ( v r ), t a = parameter figure 3-3 line capacitance: c l = f ( v r ), f = 1 mhz 10 -12 10 -11 10 -10 10 -9 10 -8 10 -7 0 1 2 3 4 5 6 i r [a] v r [v] +25 c +85 c +125 c 0 0.1 0.2 0.3 0.4 0 1 2 3 4 5 6 c l [pf] v r [v]
esd0p2rf series characteristics final data sheet 12 revision 1.0, 2011-05-19 figure 3-4 line capacitance: c l = f ( f ), v r = parameter figure 3-5 line capacitance: c l = f ( t a ), v r = parameter 0.2 0.21 0.22 0.23 0.24 0.25 0.26 0 500 1000 1500 2000 2500 3000 c l [pf] f [mhz] 0v 3.3v 5.3v 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -50 -25 0 25 50 75 100 125 c l [pf] t a [ c] 0v 3.3v 5.3v
esd0p2rf series characteristics final data sheet 13 revision 1.0, 2011-05-19 figure 3-6 iec61000-4-2 v cl = f ( t ), 8 kv positiv pulse from pin 1 to pin 2 figure 3-7 iec61000-4-2 v cl = f ( t ), 8 kv negativ pulse from pin 1 to pin 2 -20 0 20 40 60 80 100 120 -100 0 100 200 300 400 500 600 700 800 900 v cl [v] t p [ns] v cl-max-peak = 112 [v] v cl-30ns-peak = 24.8 [v] -120 -100 -80 -60 -40 -20 0 20 -100 0 100 200 300 400 500 600 700 800 900 v cl [v] t p [ns] v cl-max-peak = -116 [v] v cl-30ns-peak = -25.0 [v]
esd0p2rf series characteristics final data sheet 14 revision 1.0, 2011-05-19 figure 3-8 iec61000-4-2 v cl = f ( t ), 15 kv positiv pulse from pin 1 to pin 2 figure 3-9 iec61000-4-2 v cl = f ( t ), 15 kv negativ pulse from pin 1 to pin 2 -20 0 20 40 60 80 100 120 140 160 180 -100 0 100 200 300 400 500 600 700 800 900 v cl [v] t p [ns] v cl-max-peak = 162 [v] v cl-30ns-peak = 37.4 [v] -180 -160 -140 -120 -100 -80 -60 -40 -20 0 20 -100 0 100 200 300 400 500 600 700 800 900 v cl [v] t p [ns] v cl-max-peak = -169 [v] v cl-30ns-peak = -37.6 [v]
esd0p2rf series characteristics final data sheet 15 revision 1.0, 2011-05-19 figure 3-10 clamping voltage : i tlp = f ( v tlp ) [4] 0 10 20 30 40 0 5 10 15 20 25 30 35 40 45 50 55 60 0 5 10 15 20 i tlp [a] equivalent v iec [kv] v tlp [v] esd0p2rf-02xx r dyn r dyn =1.0
esd0p2rf series application information final data sheet 16 revision 1.0, 2011-05-19 4 application information figure 4-1 single line, bi-directional esd / transient protection [1] , [2] , [3] application_esd0p2rf -02xx.vsd esd sensitive device 1 2 connector protected signal line the protection diode should be placed very close to the location where the esd or other transients can occur to keep loops and inductances as small as possible . pin 2 (or pin 1) should be connected directly to a ground plane on the board . i/ o
esd0p2rf series ordering information scheme (examples) final data sheet 17 revision 1.0, 2011-05-19 5 ordering information scheme (examples) figure 5-1 ordering information scheme esd 5v3 u - xx yy package or application xx = pin number (i.e.: 02 = 2 pins; 03 = 3 pins) yy = package family: ls = tsslp lrh = tslp s = sot363 u = sc74 xx = application family: lc = low clamp hdmi u ni- / b i-directional or r ail to r ail protection maximum working voltage v rwm in v: (i.e.: 5v3 = 5.3v) esd 0p1 rf - xx yy package xx = pin number (i.e.: 02 = 2 pins; 03 = 3 pins) yy = package family: ls = tsslp lrh = tslp for r adio f requency applications line capacitance c l in pf: (i.e.: 0p1 = 0.1pf) n u n umber of protected lines (i.e.: 1 = 1 line; 4 = 4 lines) capacitance: s tandard (>10pf), l ow (<10pf), u ltra-low (<1pf)
esd0p2rf series package information final data sheet 18 revision 1.0, 2011-05-19 6 package information 6.1 pg-tslp-2-17 (mm) [5] figure 6-1 pg-tslp-2-17: package overview figure 6-2 pg-tslp-2-17: footprint figure 6-3 pg-tslp-2-17: packing figure 6-4 pg-tslp-2-17: marking (example) tslp27po v02 0.05 0.6 1 2 0.05 0.65 0.035 0.25 1) 1 0.05 0.05 max. +0.01 0.39 -0.03 1) dimension applies to plated terminal cathode marking 1) 0.035 0.5 bottom view top view tslp-2-7-fp v01 0.45 0.275 0.275 0.375 0.925 copper solder mask stencil apertures 0.35 1 0.6 0.35 0.3 tslp-2-7-tp v03 0.76 4 1.16 0.5 orientation marking 8
esd0p2rf series package information final data sheet 19 revision 1.0, 2011-05-19 7 package information 7.1 pg-tsslp-2-1 (mm) [5] figure 7-1 pg-tsslp-2-1: package overview figure 7-2 pg-tsslp-2-1: footprint figure 7-3 pg-tsslp-2-1: packing figure 7-4 pg-tsslp-2-1: marking (example) tsslp-2-1,-2-po v05 0.035 0.32 1 2 0.025 0.355 0.025 0.2 1) 0.62 0.035 +0.01 0.31 -0.02 1) dimension applies to plated terminal cathode marking 1) 0.025 0.26 bottom view top view 0.27 0.19 0.19 0.19 copper solder mask stencil apertures 0.57 0.24 0.62 0.32 0.24 0.14 tsslp-2-1,-2-fp v02 ex 4 ey 0.35 cathode marking 8
esd0p2rf series references final data sheet 20 revision 1.0, 2011-05-19 references [1] infineon ag - application note an167 : esd protection for broadband lna bga728l7 for portable and mobile tv applications [2] infineon ag - application note an178 : esd protection for rf antennas using infineon esd0p4rfl and esd0p2rf-xx [3] infineon ag - application note an200 : low cost fm radio lna using bfr340f for mobile phone applications [4] infineon ag - application note an210 : effective esd protection design at system level using vf-tlp characterization methodology [5] infineon ag - recommendations for pcb a ssembly of infineon tslp and tsslp packages
esd0p2rf series terminology final data sheet 21 revision 1.0, 2011-05-19 terminology c l line capacitance eft electrical fast transient esd electrostatic discharge gps global positioning system iec international electrotechnical commission i pp peak pulse current i r reverse current lna low noise amplifier r dyn dynamic resistance rohs restriction of hazardous substances directive t a ambient temperature tlp transmission line pulse t op operation temperature t p pulse duration t r pulse rise time t stg storage temperature uwb ultra wideband v br breakdown voltage v cl reverse clamping voltage v esd electrostatic discharge voltage v r reverse voltage v rwm maximum reverse working voltage
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